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DTSTAMP:20260424T143455Z
UID:1760952600@ist.ac.at
DTSTART:20251020T113000
DTEND:20251020T123000
DESCRIPTION:Speaker: Shengduo Xu\nhosted by Jorryt Matthee\nAbstract: Abstr
 act: Thermoelectric (TE) devices provide solid-state cooling without the n
 eed for refrigerants or mechanically complex systems. Globally\, the therm
 oelectric device market is expected to grow from USD $1.5 billion in 2024 
 to $4.2 billion in 2033\, with even greater potential if manufacturing cos
 ts can be further reduced. Current manufacturing of thermoelectric materia
 ls and devices often relies on costly\, hard-to-scale processes such as sp
 ark plasma sintering and machining\, which hinder large-scale deployment. 
 3D printing\, particularly direct ink writing\, offers an efficient route 
 to fabricating shape-conformable thermoelectric materials and addresses th
 e cost and scalability challenges of conventional methods.In this presenta
 tion\, I will demonstrate how 3D printing can be harnessed to produce low-
 cost\, high-efficiency TE devices. By developing specialized printable ink
 s\, we directly create complex structures with enhanced performance. The p
 rinted TE cooler achieves a temperature difference of 50 °C under ambient
  conditions\, demonstrating the feasibility of scalable\, high-performance
  devices. This approach dramatically simplifies the manufacturing workflow
 \, providing a rapid and cost-effective route for TE device production. Be
 yond advancing TE technology\, our work establishes a broader framework fo
 r the formulation of functional inks for 3D printing of semiconducting mat
 erials\, opening new paths for energy-efficient thermal management across 
 applications ranging from electronics to biomedical systems.
LOCATION:Raiffeisen Lecture Hall\, ISTA
ORGANIZER:diana.gruber@ista.ac.at
SUMMARY:Shengduo Xu: 3D Printed Thermoelectrics: From Bricks to Bridges
URL:https://talks-calendar.ista.ac.at/events/5853
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